The Institute of Semiconductor Industry and Technology, Hiroshima University and the Setouchi Semiconductor Consortium jointly host individual lectures on hot topics related to the semiconductor industry and technology.

In the fourth session (June 14), Dr. Yokoi of Micron Memory Japan spoke about the requirements and technologies for high-bandwidth memory (HBM) from the viewpoint of silicon processes, and 3D packaging technology, which has become very important along with miniaturization as AI is rapidly spreading.
There were nearly 200 attendees both in person and online.

The next lecture is scheduled on July 30 by Dr. Hiroshi Watanabe (Professor, National Yang-Ming Jiao Tong University).

The next seminar will be held on July 30, 2012 at the Institute of Semiconductor Industry and Technology, Hiroshima University.
The world and Japanese economy surrounding the semiconductor industry and the technologies required in the future" by Dr. Nahomi Aoto, Professor, Hiroshima University, on January 12, 2024.
Second session (March 28, 2024): "The Boundary between Analog and Digital, Mastering with Systems Thinking" by Toshihiko Hamasaki, Professor at Hiroshima Institute of Technology
3rd Session (May 13, 2024) "ASML & ASML San Jose introduction & Metrology Technology overview" Kiyoshi Miyashita, ASML Principal Electrical Engineer
Session 4 (June 14, 2024) "Silicon Process Challenges for High Bandwidth Memory," Naoki Yokoi, Sinior Manager, Micron Memory Japan, Inc.
Session 5 (scheduled for July 30, 2024) "Silicon Brain," Dr. Hiroshi Watanabe, Professor, National Yang-Ming Chiao Tung University (Taiwan)